{"ID":2852501,"CreatedAt":"2026-06-01T04:54:23.091178241Z","UpdatedAt":"2026-06-01T04:54:23.091178241Z","DeletedAt":null,"paper_url":"https://arxiv.org/abs/2511.05506","arxiv_id":"2511.05506","title":"YAP+: Pad-Layout-Aware Yield Modeling and Simulation for Hybrid Bonding","abstract":"Three-dimensional (3D) integration continues to advance Moore's Law by facilitating dense interconnects and enabling multi-tier system architectures. Among the various integration approaches, Cu-Cu hybrid bonding has emerged as a leading solution for achieving high interconnect density in chiplet integration. In this work, we present YAP+, a yield modeling framework specifically tailored for wafer-to-wafer (W2W) and die-to-wafer (D2W) hybrid bonding processes. YAP+ incorporates a comprehensive set of yield-impacting failure mechanisms, including overlay misalignment, particle defects, Cu recess variations, surface roughness, and Cu pad density. Furthermore, YAP+ supports pad layout-aware yield analysis, considering critical, redundant, and dummy pads across arbitrary 2D physical layout patterns. To support practical evaluation, we developed an open-source yield simulator, demonstrating that our near-analytical model matches simulation accuracy while achieving over 1,000x speedup in runtime. This performance makes YAP+ a valuable tool for co-optimizing packaging technologies, assembly design rules, and system-level design strategies. Beyond W2W-D2W comparisons, we leverage YAP+ to investigate the impact of pad layout patterns, bonding pitch, and pad ratios across different pad types, and explore the benefits of strategically placing redundant pad replicas.","short_abstract":"Three-dimensional (3D) integration continues to advance Moore's Law by facilitating dense interconnects and enabling multi-tier system architectures. Among the various integration approaches, Cu-Cu hybrid bonding has emerged as a leading solution for achieving high interconnect density in chiplet integration. In this w...","url_abs":"https://arxiv.org/abs/2511.05506","url_pdf":"https://arxiv.org/pdf/2511.05506v1","authors":"[\"Zhichao Chen\",\"Puneet Gupta\"]","published":"2025-10-20T00:40:45Z","proceeding":"cs.AR","tasks":"[\"cs.AR\",\"cond-mat.mtrl-sci\"]","methods":"[]","has_code":false}